The latter is said to be working on a flip chip ball grid array (FC-BGA) for Apple's next-generation Mac CPUs (for those who prefer technical specifics). The FC-BGA semiconductor substrate links the semiconductor chip to the main substrate.
According to ET News, Samsung Electro-Mechanics will build the device this year and supply it to Apple. According to the publication, the business also supplied FC-BGA substrates for Apple's M1 processor.
Bloomberg reports that Apple has begun "widespread internal testing" of "many" new Macs with next-generation M2 CPUs.
The article says the tech giant is testing at least nine new Macs with four different M2-based chips. They include:
- • A MacBook Air with an M2 chip that features an 8-core CPU and 10-core GPU;
- • A Mac mini with the M2 chip and a variant with the M2 Pro chip;
- • An entry-level 13-inch MacBook Pro with M2 chip;
- • 14 and 16-inch MacBook Pro models with M2 Pro and M2 Max chips. The M2 Max chip features a 12-core GPU and 38-core GPU, along with 64GB Memory.
- • A Mac Pro that will include a successor to the M1 Ultra used in the Mac Studio.